• Two-component, solvent-free epoxy-based die casting mold material that provides electrical insulation.
• It is resistant to water, moisture, abrasion, impact, acid-alkali, salt water, • gasoline, most chemicals and corrosive materials. After it gets hard, it forms a hard-solid film which has a high mechanical resistance.
• Mixing Ratio : 3 : 1 ( By Weight )
• Gelling Time: 60 minutes
• Packaging : 6 KG Pail (A+B)
24 KG Pail (A+B)

Application Areas:

• Generating electrical isolation without any space; provides dimensional stability and also when it applied to molds, it provides shock and vibration resistance.

• It prevents the ingress of dust, moisture and short circuits in electronic materials

• It is used for Isolation of electronic circuits, the sealing of electronic circuits, Protection of mechanical-chemical effects, Insulators, Instrument transformers, Capacitors, Current and power transformers